SELSE – Silicon Errors in Logic – System Effects
SELSE-13: The 13th Workshop on Silicon Errors in Logic – System Effects
21-22 March 2017, Northeastern University, Boston, Massachusetts
The growing complexity and shrinking geometries of modern manufacturing technologies are making high-density, low-voltage devices increasingly susceptible to the influences of electrical noise, process variation, transistor aging, and the effects of natural radiation. The system-level impact of these errors can be far-reaching. Growing concern about intermittent errors, unstable storage cells, and the effects of aging are influencing system design and failures in memories account for a significant fraction of costly product returns. Emerging logic and memory device technologies introduce several reliability challenges that need to be addressed to make these technologies viable. Finally, reliability is a key issue for large-scale systems, such as those in data centers. The SELSE workshop provides a forum for discussion of current research and practice in system-level error management. Participants from industry and academia explore both current technologies and future research directions (including nanotechnology). SELSE is soliciting papers that address the system-level effects of errors from a variety of perspectives: architectural, logical, circuit-level, and semiconductor processes. Case studies are also solicited.
Key areas of interest are (but not limited to):
- Technology trends and the impact on error rates.
- New error mitigation techniques.
- Characterizing the overhead and design complexity of error mitigation techniques.
- Case studies describing the tradeoffs analysis for reliable systems.
- Experimental silicon failure data.
- System-level models: derating factors and validation of error models.
- Error handling protocols (higher-level protocols for robust system design).
- Characterization of reliability of systems deployed in the field and mitigation of issues.
- Paper submission: January 16, 2017
- Authors notification: February 20, 2017
- Final paper submission: March 1, 201